Продукция

Embedded Instruments

Embedded Instruments

Increasing complexity, speed and shrinking form factors has introduced post silicon validation and debug challenges as traditional tools continue to lose visibility. Embedded Instrument solutions from Teledyne LeCroy address these challenges and offer a time-to-market advantage to our users. By embedding debug hooks into your silicon and utilizing advanced software viewing techniques users will gain valuable visibility at the chip and system levels. Debug and validation is further enhanced by utilizing Teledyne LeCroy's CrossSync capability to time correlate.


IOTA Software Suite

The Teledyne LeCroy IOTA Software Suite is designed to work with Intel's next generation processors supporting Intel Silicon View Technology™ (SVT). This brings Teledyne LeCroy's world class protocol viewing and intuitive user interface to internal trace data from various sources as defined by Intel. The internal trace data is extracted from the system using the Intel provided pod and is fully decoded, time correlated and viewed using Teledyne LeCroy's IOTA Software Suite advanced visualization and analysis software.


InSight Technology Post silicon validation and debug accounts for a growing bottleneck in time-to-market due to continuing increases in system complexity and a loss of visibility. Teledyne LeCroy's InSight Technology consists of a set of modular components designed to be used individually or as a turn-key solution. With InSight Technology, signal capture IP along with advanced viewing techniques and data storage options come together to offer enhanced validation and debug for chip and system level test.

Increasing complexity, speed and shrinking form factors has introduced post silicon validation and debug challenges as traditional tools continue to lose visibility. Embedded Instrument solutions from Teledyne LeCroy address these challenges and offer a time-to-market advantage to our users. By embedding debug hooks into your silicon and utilizing advanced software viewing techniques users will gain valuable visibility at the chip and system levels. Debug and validation is further enhanced by utilizing Teledyne LeCroy's CrossSync capability to time correlate.


Increasing complexity, speed and shrinking form factors has introduced post silicon validation and debug challenges as traditional tools continue to lose visibility. Embedded Instrument solutions from Teledyne LeCroy address these challenges and offer a time-to-market advantage to our users. By embedding debug hooks into your silicon and utilizing advanced software viewing techniques users will gain valuable visibility at the chip and system levels. Debug and validation is further enhanced by utilizing Teledyne LeCroy's CrossSync capability to time correlate.